Defect Guide

Crack

Cracks occurring during ejection, in service, or during post-processing.

Common Causes

  • Excessive residual stress (over-packing)
  • Ejection issues (ejector pin force)
  • Mold temperature too low
  • Environmental stress cracking (chemical contact)
  • Excessive injection speed

Solutions

  • Reduce hold pressure
  • Improve ejector design; apply release agent
  • Raise mold temperature
  • Allow sufficient cooling time
  • Stress-relief annealing

Resin-Specific Notes

PC

Susceptible to environmental stress cracking. Choose release agents carefully.

PMMA

Brittle material. Watch for residual stress.

PA

Directional cracking due to glass fiber orientation.

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This content is a field-reference summary. Final judgment requires on-site engineer verification.