← Defect Guide

Crack

Cracks occurring during ejection, in service, or during post-processing.

◆ Common Causes

  • •Excessive residual stress (over-packing)
  • •Ejection issues (ejector pin force)
  • •Mold temperature too low
  • •Environmental stress cracking (chemical contact)
  • •Excessive injection speed

◆ Solutions

  • ✓Reduce hold pressure
  • ✓Improve ejector design; apply release agent
  • ✓Raise mold temperature
  • ✓Allow sufficient cooling time
  • ✓Stress-relief annealing

◆ Resin-Specific Notes

PC

Susceptible to environmental stress cracking. Choose release agents carefully.

PMMA

Brittle material. Watch for residual stress.

PA

Directional cracking due to glass fiber orientation.

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This content is a field-reference summary. Final judgment requires on-site engineer verification.

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