Resin Library

PEEK

Super-EngineeringCrystallineHygroscopicity LowField Estimate

Drying Conditions

Temperature
150°C
Time
3-4h
Target Moisture
N/A

Melt Temperature

360~400°C

Thermal degradation risk above 400°C

Minimize residence time and avoid exceeding this temperature.

Mold Temperature

160~200°C

Shrinkage

No data

Common Defects & First Checks

Warpage

PEEK: highest performance, very expensive (minimize purging waste), needs special high-temp screw/barrel.

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Field Notes

PEEK: highest performance, very expensive (minimize purging waste), needs special high-temp screw/barrel. Mold too cold → amorphous/poor surface. Degradation above 400°C.

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This data is a field-reference summary. Always verify against the resin manufacturer’s official TDS.