Drying Conditions
Temperature
120°C
Time
4-6h
Target Moisture
N/A
A dehumidifying dryer is recommended (relatively hygroscopic).
Melt Temperature
240~270°C
Mold Temperature
100~140°C
Shrinkage
No data
Common Defects & First Checks
Warpage
MXD6: high Tg, high barrier, used in barrier applications.
Sink Mark
MXD6: high Tg, high barrier, used in barrier applications.
Field Notes
MXD6: high Tg, high barrier, used in barrier applications. Higher mold temp needed for good crystallinity.
Related Resins
This data is a field-reference summary. Always verify against the resin manufacturer’s official TDS.