Resin Library

PA66

EngineeringCrystallineHygroscopicity Very HighVerified

Drying Conditions

Temperature
80°C
Time
4-8h
Target Moisture
0.08%

A dehumidifying dryer is recommended (relatively hygroscopic).

Melt Temperature

275~300°C

Thermal degradation risk above 310°C

Minimize residence time and avoid exceeding this temperature.

Mold Temperature

70~100°C

GF-reinforced grade: 80-100°C

Shrinkage

1.2~2%

Common Defects & First Checks

Silver Streak

PA66: narrow processing window.

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Burn Mark

PA66: narrow processing window.

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Warpage

PA66: narrow processing window.

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Field Notes

PA66: narrow processing window. Moisture is almost always the #1 suspect (40%+ of silver streak). Thermal degradation above 300°C. GF grades warp from fiber orientation. Normal molding up to 305°C is possible; above 300°C minimize residence time.

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This data is a field-reference summary. Always verify against the resin manufacturer’s official TDS.