Resin Library

PC

EngineeringAmorphousHygroscopicity HighVerified

Drying Conditions

Temperature
120°C
Time
3-4h
Target Moisture
0.02%

A dehumidifying dryer is recommended (relatively hygroscopic).

Melt Temperature

280~320°C

Thermal degradation risk above 320°C

Minimize residence time and avoid exceeding this temperature.

Mold Temperature

70~110°C

Shrinkage

0.5~0.7%

Common Defects & First Checks

Silver Streak

PC: amorphous, very high viscosity, extreme moisture sensitivity.

View Guide

Field Notes

PC: amorphous, very high viscosity, extreme moisture sensitivity. Never mix regrind from other resins. Beyond 9-type: stress cracking from excessive pack pressure, splay, yellowing when overheated. Above 320°C or long residence time: thermal degradation + yellowing.

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This data is a field-reference summary. Always verify against the resin manufacturer’s official TDS.