Resin Library

PEN

EngineeringCrystallineHygroscopicity ModerateField Estimate

Drying Conditions

Temperature
120°C
Time
4h
Target Moisture
N/A

A dehumidifying dryer is recommended (relatively hygroscopic).

Melt Temperature

270~290°C

Mold Temperature

80~120°C

Shrinkage

No data

Common Defects & First Checks

Warpage

PEN: high barrier, high Tg, higher performance than PET, used in specialty applications.

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Field Notes

PEN: high barrier, high Tg, higher performance than PET, used in specialty applications.

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This data is a field-reference summary. Always verify against the resin manufacturer’s official TDS.