Resin Library

PBT

EngineeringCrystallineHygroscopicity ModerateVerified

Drying Conditions

Temperature
120°C
Time
4h
Target Moisture
0.03%

A dehumidifying dryer is recommended (relatively hygroscopic).

Melt Temperature

250~270°C

Thermal degradation risk above 280°C

Minimize residence time and avoid exceeding this temperature.

Mold Temperature

60~100°C

Shrinkage

1.5~2.2%

Common Defects & First Checks

Warpage

PBT: fast crystallization.

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Sink Mark

PBT: fast crystallization.

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Flash

PBT: fast crystallization.

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Field Notes

PBT: fast crystallization. Mold temp dramatically affects surface & crystallinity (60-80°C amorphous / 80-100°C crystalline). Warpage from fast uneven crystallization. Above 280°C degradation begins; ~290°C releases CO/THF fumes.

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This data is a field-reference summary. Always verify against the resin manufacturer’s official TDS.